Conductors

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Micromax™ offers a broad selection of hybrid circuit materials to meet the requirements of different substrates, operating environments, temperatures, and metallizations. Conductor materials from Micromax™ are available in a wide variety of traditional thick film compositions, including silver, gold, platinum and their alloys.

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Micromax™ offers a complete set of conductors covering a broad application spectrum.

Designed to deliver the best reliability/performance vs. system level cost, these materials enable more cost-effective manufacturing processes, including fine line printing, 30 or 60 minute firing profiles, co-fireability and unprecedented field reliability.

The conductors allow several different interconnect strategies, ranging from 25-micron gold wirebond to heavy gauge aluminum wirebond, wedge bond, ribbon bond, ball grid array (BGA), flip chips, and more.

Additional benefits include low noise characteristics (rated up to five times better than those of conventional systems), improved post-laser trim stability (improved by a factor of three), and outstanding durability at high temperatures.

Silver Conductors

Lead freet	Lead containing	Features
LF131	6160	Standard 10-15 u00b5m etchable
LS100		Laser structurable
	QM14	With blue fugitive dye
	6163	With blue fugitive dye
LF231	7740	Thick Printing >30 u00b5m
TM510		Silver sintering paste

Silver/Platinium Conductors

Micromax™ Ag/Pt conductors offer high solder leaching resistance and good soldering performances.

Lead freet	Lead containing	Ag/Pt ratio	Conductivity	Features
LF172	QR171	100:1	< 5m Ohm/sq	Alu bondable
	5164N	200:1	2,5-3 mOhm/sq	low cost /high performance
	9750R	3:1		Severe soldering conditions
THR61		100:1	<7 mOhm/sq	through hole fill

Gold based conductors

Gold conductors are used for high reliability applications owing to their low resisitivity, resistance to metal migration even in harse environments and non oxidation and corrodation properties.

Lead free	Lead containing	Wire bonding	Features
5785R	5771	Heavy Al & Au wire bondable > 25 u00b5m	compatible with ML (inner & outer layers)
	5744R	Wide bonding window with Al & Au <50 u00b5m	Dense fired film
	5747		capable of viafilling up to 3 dielectric layers in single print
5780R	QR150 / LS300	Fine Au wire bonding and etching	Fine line features & laser structurable
THR35		Through hole fill
	4597R		Solderable PtPdAu

Silver/Palladium Conductors

DuPont Silver Palladium conductors limit the silver migration in harsh envrionment and improve solderability.

Lead free	Lead containing	Ag/Pd ratio	Features
	6130	6:1	General purpose solderable conductor
LF121	7484R	3:1	Dense fired film. Excellent edge adhesion on Alumina and dielectric.
LS200		5:1	Laser structurable
9475R	4093	2.5-3:1	AgPdPt (1% Pt). Bondable
LF181		20:1	via fill burried & surface

Copper conductors

DuPont copper based conductors offer a high conductivity for application where soldering and heavy Alu wires maybe be required with excellent thermal and electrical properties such as Power electronics.

Lead free	Lead containing	Temperature	Features
	5915R	Low temp (600 u00b0C)	Solderable and through hole printable
LF911		High temp (900 u00b0C)	Solderable and Ni/Au platable
	7732	High temp (900 u00b0C)	optimized for thick print and heavy Alu wire bonding

Platinium conductors

DuPont Platinium conductors are suitable to operate at elevated temperatures and can be used as electrodes for sensors applications.

Lead free	Fritt	Firing temperature	Features	Datasheet
9141R	Fritted	800-1000u00b0C	Dense, high TCR
9896R	frittless	1100-1250u00b0C	Thick Printing, bond pad