Solder Paste

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As a leader in soldering technology, Indium Corporation offers a number of solder pastes for assembly with many different alloy choices and flux technologies to solve many of your process challenges such as miniaturized components, fine-pitch, voiding, printing and reflow performance.

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Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing industry. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects.

Lead Free Solder Pastes

Indium offers a large range of lead-free solder pastes with a variety of SAC alloys. From the industry standard SAC305 to lower silver contents SAC such as SAC0307, SAC105, SACm (doped), as well as new alloys such as Indalloy®292 engineered to provide advanced reliability for high-performance applications.

Name	Alloy	Cleanability	Flux type	Process	Features
Indium8.9HF	SAC	No-Clean	ROL0	Printing	Best all-around halogen-free solder paste.
Indium10.8HF	SAC	No-clean	ROL0	Printing	Addresses non-wet opens (NWOs)
Indium8.9HF	Indalloy®292	No-clean	ROL0	Printing	Hi-Reliability thermal cycling at -40/150°C , high shear strength, enhanced SIR
Indium10.8HF	Durafuse™ LT	No-clean	ROL0	Printing	High reliability low temperature peak reflow < 210°C
Indium12.8HF	SAC	No-clean	ROL0	Jetting & dispensing	Optimized for long-term jetting and microdispense applications
Indium3.2HF	SAC	Water soluble	ORH0	Printing	Water-wash solder paste

Lead Containing Solder Pastes

Name	Alloy	Cleanability	Flux type	Process	Features
NC-SM92J	SnPb	No-Clean	ROL0	Printing	Industry leading SnPb solder paste. Optimized for ICT.
NC-SMQ92H	SnPb	No-Clean	ROL0	Printing	Industry leading SnPb solder paste. Optimized printing performance.
Indium6.6HF	SnPb	Water-Soluble	ORH0	Printing	Low voiding water soluble solder paste
NC-SMQ51SC	SnPb & SAC	No-clean	ROL1	Printing	Exceptional stencil life and tack strength. Consistent ultra-fine pitch print definition
RMA-155	SnPb & Pb-free	RMA	ROL0	Printing	Hi performance and ideal for mixed alloy SnPb and Pb-free processes
NC-SMQ80	InPb	No-Clean	ROL0	Printing	Designed for Indium based alloys. Reduced leaching/scavenging on gold or silver.

Lead Free Solder Pastes

Lead Containing Solder Pastes

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