Making hole conductive
Request a sampleDuPont’s longstanding expertise in electroless copper plating is an excellent match for the demands of high density pcb including rigid-flex . DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.
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Circuposit™ Desmear
Circuposit™ desmear process results from DuPont long expertise in a solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent Circuposit™ Promoter stage. This process defines a new standard for via plating. The serie contains products formulated to process both traditional FR-4 type laminates and more advanced high Tg materials.
| Designation | Description | |
|---|---|---|
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Sweller |
CIRCUPOSIT HOLE PREP 4120 |
Standard |
|
Sweller |
CIRCUPOSIT HOLE PREP 4126 |
Multi purpose, high and low Tg |
|
Promoter |
CIRCUPOSIT PROMOTER 3310/4140 |
Standard vertical |
|
Promoter |
CIRCUPOSIT PROMOTER 4130 |
More agressive, better penetration in small holes. Soluble at 20°C. Sodium Permanganate based. |
|
Neutraliser |
CIRCUPOSIT NEUTRALIZER 3314 |
Permanganate neutraliser |
|
Neutraliser |
CIRCUPOSIT 3319-1 |
Neutraliser and conditionner |
Making hole conductive
| Type | Name | Description | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| Electroless Copper chemistry | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Conditionner |
Large range of advanced conditionning chemistry for all type of materials and Tg. |
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Thin copper |
CUPOSIT 328Qi |
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Thin or thick copper |
CIRCUPOSIT 3350-1 |
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| Direct metallisation | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Palladium based |
CRIMSON |
Excellent stability and versatility |
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Conductive carbon |
GRAPHITE 2000 |
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