Semiconductor Packaging Materials
Request a sampleDuPont develops new materials to meet ever changing requirements, from workhorse packages like flip-chip technologies to emerging technologies like fan-out wafer level packaging and through silicon vias (TSVs). DuPont is a technology leader in electroplating materials used for underbump metallization (UBM), copper redistribution layer (RDL), Cu pillars, and solder bumps, along with polymers and dielectrics for RDL, photoresists and TSV fill.
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With more than 50 years invested in technology development, DuPont Electronics & Imaging understands the needs in the market and has developed a broad portfolio of semiconductor packaging materials for a range of technology areas including the product families in the table below:
| Family | Description | Applications | Product names |
|---|---|---|---|
|
Copper Pillar Plating |
Ultra-Pure Fine-Pitch copper plating chemistry |
Cu pillar, Cu stud, and Cu µpillar processes used in advanced WLP architectures, from flip-chip processes, to 2.5D and 3D integration schemes. Work in perfect harmony with DuPont UBM chemistries. |
|
|
Copper Redistribution Layer |
High-purity copper electroplating chemistries for fine-line RDL and improved via-filling performance |
Ideally Suited for Fan-in and Fan-out Wafer Level Packaging |
Intervia™ 8540 & 9000 |
|
Solder Bump Plating |
HVM-proven tin-silver plating chemistry |
Lead-free, fine-pitch solder bump applications with industry-leading process versatility |
Solderon™ BP |
|
Under Bump Metallization |
nickel plating chemistry |
under bump metallization (UBM) |
Nikal BP Chemistry |
|
Bump Plating Photoresists |
Positive- and negative-tone dry film & liquid photoresists |
Designed to meet the tight pitches and varied topographies of today’s advanced wafer level packaging, MEMS, and 3D photolithography applications |
Liquid: Intervia™ BCPR-i 4500, Shipley BPR™ 100 |
|
Through Silicon Via Copper |
Leading-edge copper through silicon via (TSV) chemistries |
Memory stacking, CMOS image sensors, MEMS devices, and 2.5D interposer architectures |
Interlink™ 9200 Copper |
|
Packaging Dielectrics |
BCB-based Cyclotene™ and epoxy-based Intervia™ dielectric |
Insulating distribution wiring from the chip to the package substrate to the circuit board |
Intervia™ Photodielectric & Cyclotene™ Advanced Electronic Resin Serie |