PCB final finishes
Request a sampleENIG, ENEPIG, Tin and SnPb high performing PCB latest final finish product from DuPont Electronic Solutions. Designed to lower board manufacturer process costs, while maintaining optimum reliability and performance.
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Tin & Tin-Lead plating and stripping
Tinposit™ Immersion Tin is a tin deposition product, which produces uniform, smooth tin deposits on copper and copper-based alloys by an immersion reaction. Ronastan™ is an acidic tin plating solution which produces smooth, fine-grained deposits over a wide plating range. Ronastan™ deposits are designed for use as etch resists in the manufacture of PCBs, with excellent throwing power and metal distribution, even in high-aspect through holes and microvias.
| Type | Deposit | Designation | Features |
|---|---|---|---|
|
Electrolytic |
Tin plating |
RONASTAN EC |
Sulfuric base |
|
Electroless |
Tin deposit |
TINPOSIT |
|
|
Electrolytic |
SnPb (60/40) plating |
SOLDERON PC |
high stability of the alloy, very high distribution, MSA-base |
|
Tin Stripper |
ENVIROSTRIP™ 785 |
High efficency one step stripper |
|
|
Tin Stripper |
RONASTRIP TL85 |
Nitric acid free |
Nickel, Gold & Palladium deposit
Aurolectroless™ Immersion Gold and Duraposit™ Electroless Nickel from DuPont Electronic Solutions are designed to lower board manufacturer’s ENIG process costs, while maintaining optimum reliability and performance. The product delivers uniform, fine-grained deposits of pure gold on substrates including electroless Nickel and Palladium.
| Type | Deposit | Designation | Features |
|---|---|---|---|
|
Electroless |
ENIG: Nickel – Gold |
RONAMAX SMT |
|
|
Electroless |
ENIG: Nickel – Gold |
Duraposit™ SMT 88 |
Improved corrosion resistance |
|
Electroless |
Palladium |
PALLAMERSE |
|
|
Electroless |
ENEPIG: Ni – Pd – Au |
AUROLECTROLESS |
High stability, low gold concentration & EDTA-free versions |
|
Electrolytic |
Nickel-Gold |
NIKALPC3 + AURONAL BGA |